PCB Trace Width calculator
As technology advances, the volume of electronic devices become smaller and smaller space, increasing density of electronic components, PCB wiring density is increasing. If you do not pay attention and raise heat and trace width, temperature and line voltage drop and power consumption will lead to a serious decline in the reliability of electronic equipment. Both consider the heat, then go online to consider the voltage drop PCB, PCB traces is to pay attention to some of the rules. PCB's heat issues are complex, confined space or on the mounting of components and PCB on the PCB will have a huge impact of temperature rise. Here does not consider the impact of mounting components, only the free space to consider the air temperature and current, width (diameter) relationship.
Under the IPC document, the circuit board temperature rise ΔT, the conductor cross-sectional area (thickness * width = Copper Platinum) A and the current I as relations between
Where coefficient K is a curve, PCB trace the inner and outer alignment very different K values (easier to heat the outer layer). Approximate a straight line for K, for simplicity, at room temperature (25 degrees C) is going to take the inner line K = 0.024, the outer trace K = 0.048.
Enter the required PCB trace carrying a current I, the design temperature rise ΔT, the thickness of laying copper trace length L T and width W and calculate the required resistance generated by R, U line voltage drop and power consumption P. PCB outer and inner layer were calculated.
When the trace in the inner layer of the PCB:
| Temperature rise ΔT | ||
| Thickness of the track T | ||
| Current I | ||
| Length L | ||
| Width of the track W | ||
| Trace resistance | ||
| Voltage drop | ||
| Power dissipation | ||
When the trace in the outer layer of the PCB:
| Temperature rise ΔT | ||
| Thickness of the track T | ||
| Current I | ||
| Length L | ||
| Width of the track W | ||
| Trace resistance | ||
| Voltage drop | ||
| Power dissipation | ||